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Spin Coating


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Spin Coating

Usually deployed in R&D and pilot scale systems spin coating is a common technique used to apply uniform thin films to flat substrates. Usually an excess amount of a solution is dispensed onto the substrate, which is then rotated at high speeds in order to spread the fluid uniformly by centrifugal force.


Rotation is continued while the fluid spins off the edges of the substrate, until the desired thickness of the film is achieved. The applied solvent is usually volatile and simultaneously evaporates. The achievable film thickness is a function of angular spinning speed, solid material content of the solution and the type of solvent.


Once spin-coating is complete, the plate is typically placed onto a hotplate (heated to somewhere between 80°C to 160°C) for several seconds or minutes to initially evaporate residual solvent and solidify the coating.


Depending on the layer thickness and the solvent the substrate is then baked-out for several hours, or typically overnight, in a convection or vacuum oven, at a temperature high enough to sufficiently remove the remaining solvent. Some materials are more difficult to coat than others.


Most often poor quality, hazy, or "Mura defect" coatings are the result of moisture absorption due to environmental humidity. Strict control over the laboratory environment is the best way to improve coating quality, so the integration of spin coaters into gloveboxes or generally into inert gas equipment is preferable so that the sample does not have a chance to absorb moisture.


For more demanding processes one should consider having the spin coater integrated into an inert, laminar flow enclosure to eliminate the disadvantageous effects of moisture and particles. Major advantages of this technique are cost-efficiency, a limited set of process parameters to be controlled, low maintenance, ease of operation and adaptability to a variety of different processes.


However spin coating reaches its limits when material usage and coating of large areas comes into consideration. Due to the process nature about 90% to 95 % of the feed material is spun off the substrate and is withdrawn from the process bowl as waste material. Especially in OLED applications where the active materials constitute a significant cost factor alternative coating solutions should be considered.

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The MB-SC-210 is an easy-to-use spincoater for precise and uniform deposition of thin films and coatings. Its compact, vibration free and inertgas compatible design makes it a versatile and vital tool in every research facility.


The MB-SC-210 has been specifically designed for the research & development of new processes and products in the organic electronics industry with the focus on solvent based materials. The coater is built in several modules which allow configuring the overall system setup to meet the individual requirements of each application. Glovebox compatible and user friendly the individual modules provide a convenient step-to-step approach for processing metal-organic solutions under inert conditions.


A menu-driven program and a lucid set of adjustable process parameters such as process time and rotation speed provide a reliable process platform even for users who do not have in-depth experience in spin coating techniques. Several standardized and customized chucks are available to give sufficient support to the substrate even at high rotation speeds.


All chucks are machined to close tolerances to assure a smooth spinning process and uniform coating. The chuck selection should be based on substrate size, weight, shape and material in order to optimize the coating process and ensure repeatable results.


In summary the MB-SC-210 with all its optional features enables quick-testing of new material formulations and optimization work of existing processes thus making it a powerful and economic tool for your research.

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